WBLC9 Module Datasheet

WBLC9 is a low-power embedded Wi-Fi and BLE module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions.

Overview

WBLC9 is embedded with a low-power 32-bit microcontroller unit (MCU), 2 MB flash memory, 256 KB static random-access memory (SRAM), and extensive peripherals.

WBLC9 is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

• Embedded low-power 32-bit CPU, which can also function as an application processor
• Dominant frequency: 120 MHz
• Working voltage: 3.0 V to 3.6 V
• Peripherals: 6 GPIOs
• Wi-Fi connectivity
  • 802.11 b/g/n
  • Channels 1 to 14 at 2.4 GHz
  • Support WEP, WPA/WPA2, WPA/WPA2 PSK (AES) security modes
  • Up to +17.5dBm output power in 802.11b mode
  • STA, AP, and STA+AP working modes
  • EZ and AP net pairing modes for Android and iOS devices
  • Onboard ceramics antenna with a gain of 0.5 dBi
  • Working temperature: -40°C to +105°C
• BLE connectivity
  • Support for BLE4.2
  • Maximum output power of +6 dBm
  • Onboard ceramics antenna

Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Change history

Module interfaces

Dimensions and footprint

WBLC9 has two rows of pins with a 2±0.1 mm pin spacing.

The WBLC9 dimensions (W x L x H ) are 15±0.35mm (W)×16.8±0.35mm (L) ×3.0±0.15mm (H). The figure shows the WBLC9 front and rear views.

Interface pin definition

Test pin definition

Electrical parameters

Absolute electrical parameters

Working conditions

Current consumption during constant transmission and receiving

Working current

RF features

Basic RF features

TX performance

Performance during constant transmission

RX performance

RX sensitivity

Antenna

Antenna type

WBLC9 uses an Onboard ceramics antenna.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard ceramics antenna.

Packaging information and production instructions

Mechanical dimensions

The PCB dimensions (W x L x H) are 15±0.35mm (W)×16.8±0.35mm (L) ×1.0±0.15mm (H).

Recommended schematic encapsulation

Recommended PCB Encapsulation-SMT

WBLC9 module is inserted and welded.

Production instructions

1. Use an SMT placement machine to mount components to the stamp hole module that Tuya produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting components to the module.

   • SMT placement equipment:
     • Reflow soldering machine
     • Automated optical inspection (AOI) equipment
     • Nozzle with a 6 mm to 8 mm diameter
   • Baking equipment:
     • Cabinet oven
     • Anti-static heat-resistant trays
     • Anti-static heat-resistant gloves

2. Storage conditions for a delivered module are as follows:

   • The moisture-proof bag is placed in an environment where the temperature is below 30°C and the relative humidity is lower than 70%.
   • The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
   • The package contains a humidity indicator card (HIC).
     

3. Bake a module based on HIC status as follows when you unpack the module package:

   • If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
   • If the 30% circle is pink, bake the module for 4 consecutive hours.
   • If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
   • If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.

4. Baking settings:

   • Baking temperature: 125±5℃
   • Alarm temperature: 130℃
   • SMT placement ready temperature after natural cooling: < 36°C
   • Number of drying times: 1
   • Rebaking condition: The module is not soldered within 12 hours after baking.

5. Do not use SMT to process modules that have unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.

6. Before SMT placement, take electrostatic discharge (ESD) protective measures.

7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

Recommended oven temperature curve

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245°C.

Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.

MOQ and packing information

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.

The RF module is considered as a limited modular transmitter according to FCC rules. Even though the RF module gets an FCC ID, the host product manufacturer can not use the FCC ID on the final product directly. In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining the FCC authorization by a Class II permissive change application or a new application.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.