WBRG1 Module Datasheet

WBRG1 is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated wireless RF chip (RTL8721CSM) and an external flash chip, with an embedded Wi-Fi network protocol stack and varied library functions.

Overview

With the maximum CPU clock rate of 200 MHz, WBRG1 also contains a KM4 microcontroller unit (MCU), a low-power KM0 MCU, a WLAN MAC, a 1T1R WLAN module, a 4-MB pseudo-static random-access memory (PSRAM), 8-MB flash memory, and rich extensive peripherals.

WBRG1 is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP. You can develop embedded Wi-Fi products as required.

Features

Applications

Change history

Update date Updated content Version after update
10/10/2020 The first release. V1.0.0

Module interfaces

Dimensions and package

WBRG1 has 3 rows of pins with a 1.5 mm pin spacing.
As shown in the following figures, the dimensions of WBRG1 are 19±0.35 mm (W)×25.7±0.35 mm (L) ×2.9±0.1 mm (H). The thickness of the PCB is 0.8±0.1 mm.

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Pin definition

Symbol I/O type Function
RTS0 I/O PA 16, which corresponds to Pin 29 and is a serial port Uart0 flow control request-to-send pin
RX0 I/O PA 19, which corresponds to Pin 32 and Uart0_RX and is the docking serial port of a user’s MCU
PA28 I/O PA 28, which corresponds to Pin 38, is a hardware PWM and can be configured as a GPIO
I2C_SCL I/O PB 5, which corresponds to Pin 45 and can be configured as an I2C or GPIO
I2C_SDA I/O PB 6, which corresponds to Pin 46 and can be configured as an I2C or GPIO
PB7 I/O PB7, which corresponds to Pin 47, is a hardware PWM and can be configured as a GPIO
PB4 I/O PB4, which corresponds to Pin 44, is a hardware PWM and can be configured as a GPIO
EN P Enabling pin, which works at the voltage of 3.3V and is pulled up
GND P Power supply reference ground
PRI I/O PB1, which corresponds to Pin 41 and has the PTA_PRI function
REQ I/O PA26, which corresponds to Pin 39 and has the PTA_REQ function
GNT I/O PA27, which corresponds to Pin 33 and has the PTA_GNT function
TX0 I/O PA18, which corresponds to Pin 31 and Uart0_TX and is the docking serial port of a user’s MCU
CTS0 I/O PA17, which corresponds to Pin 30 and is a serial port Uart0 flow control clear-to-send pin
RX1 I/O PA13, which corresponds to Pin 26 and Uart1_RX and is the docking serial port of a user’s MCU
TX1 I/O PA12, which corresponds to Pin 25 and Uart1_TX and is the docking serial port of a user’s MCU
3V3 P Power supply pin (3.3V)
PA25 I/O PA 25, which corresponds to Pin 40, is a hardware PWM and can be configured as a GPIO
PB22 I/O PB 22, which corresponds to Pin 60, is a hardware PWM and can be configured as a GPIO
AOUTP_L I/O PB31, which corresponds to Pin 65, audio’s analog output positive electrode (left channel)
MIC GND I/O MIC_GND
MIC1_P I/O PA4, which corresponds to Pin 3, the input positive electrode of MIC1, main MIC
Log TX I/O PA7, which corresponds to Pin 7 and is used to print system logs
Log Rx I/O PA8, which corresponds to Pin8 and is used to print system logs
PB23 I/O PB23, which corresponds to Pin 61, is a hardware PWM and can be configured as a GPIO

Note: P indicates a power supply pin and I/O indicates an input/output pin.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -40 105
VBAT Power supply voltage -0.3 3.6 V
Static electricity discharge voltage (human body model) TAMB-25℃ - 2 KV
Static electricity discharge voltage (machine model) TAMB-25℃ - 0.5 KV

Normal working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature -20 - 85
VCC Power supply voltage 3.0 3.3 3.6 V
VIL I/O low level input - - 0.8
VIH I/O high-level input 2.0 - - V
VOL I/O low level output - - 0.4 V
VOH I/O high level output 2.4 - -
Imax I/O drive current - - 16 mA
Cpad Input pin capacitance - 2 - mA

TX power consumption

Symbol Mode Power Average value Peak value (Typical value) Unit
IRF 11b 11Mbps 17 dBm 247 272 mA
IRF 11b 11Mbps 18 dBm 252 285 mA
IRF 11g 54Mbps 15 dBm 177 238 mA
IRF 11g 54Mbps 17.5 dBm 202 280 mA
IRF 11n BW20 MCS7 13 dBm 165 240 mA
IRF 11n BW20 MCS7 16.5 dBm 192 269 mA
IRF 11n BW40 MCS7 13 dBm 144 236 mA
IRF 11n BW40 MCS7 16.5 dBm 166 266 mA

RX power consumption

Symbol Mode Average Value Peak Value (Typical Value) Unit
IRF 11B 11M 61 77 mA
IRF 11G 54M 61 75 mA
IRF 11N HT20 MCS7 61 77 mA

Power consumption in working mode

Working mode Working status, TA = 25°C Average value Peak value (Typical value) Unit
Quick network connection state (Bluetooth ) The module is in the fast network connection state and the Wi-Fi indicator flashes fast 57 284 mA
Quick network connection state (AP) The module is in the fast network connection state and the Wi-Fi indicator flashes slowly 203 392 mA
Quick network connection state (EZ) The module is in the fast network connection state and the Wi-Fi indicator flashes fast 55 298 mA
Idle state The module is connected to the network and the- indicator is always on 53 259 mA
Operation state The module is connected to the network and the WiFi indicator is always on 56 293 mA
Disconnected state The module is disconnected 58 287 mA

Note: The above parameters vary with firmware functions.

RF parameters

Basic RF features

Parameter Description
Frequency range 2.400 to 2.4835 GHz
Wi-Fi standard IEEE 802.11b/g/n (channels 1 to 14)
Bluetooth LE standard Bluetooth LE 5.0
Data transmission rate 11b: 1, 2, 5.5, and 11 (Mbps)
Data transmission rate 11g: 6, 9, 12, 18, 24, 36, 48, and 54 (Mbps)
Data transmission rate 11n: HT20 MCS 0 to 7
Data transmission rate 11n: HT40 MCS 0 to 7
Antenna type PCB antenna with a gain of 1.05 dBi

TX performance

TX performance

Parameter Minimum value Typical value Maximum value Unit
Average RF output power, 802.11b CCK Mode 11M - 17.5 - dBm
Average RF output power, 802.11g OFDM Mode 54M - 14.5 - dBm
Average RF output power, 802.11n HT20 Mode MCS7 - 13.5 - dBm
Average RF output power, 802.11n HT40 Mode MCS7 - 13.5 - dBm
Average RF output power, Bluetooth LE5.0 - 6.5 - dBm
Frequency error -20 - 20 ppm
EVM@802.11b CCK 11 Mbps Mode 17.5 dBm - - -10 dB
EVM@802.11g OFDM 54 Mbps Mode 14.5 dBm - - -29 dB
EVM@802.11n OFDM MCS7 Mode 13.5 dBm - - -30 dB

RX performance

RX sensitivity

Parameter Minimum value Typical value Maximum value Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 1M - -97 - dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M - -76 - dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 - -73 - dBm

Antenna

Antenna type

WBRG1 supports two types of antennas: onboard PCB antenna and external antenna. By default, the onboard PCB antenna is preferred.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.

To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.

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U.FL RF connector

Parameters of the U.FL RF connector are as below:

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Packaging information and production instructions

Mechanical dimensions

The PCB dimensions are 19±0.35 mm (W)×25.7±0.35 mm (L) ×0.8±0.15 mm (H).

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Note: For the PCB frame, the dimensional tolerance is ±0.35 mm, and for the thickness of the PCB, the dimensional tolerance is ±0.1 mm.

The diagram of PCB packaging

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Mounting requirements

Use an SMT machine to mount components to the stamp hole module that Tuya produces within 24 hours after the module is unpacked and the firmware is burned. If not, pack the module again in a vacuum.

Note:

The following equipment or instrument is required:

Instrument/device Description
SMT machine
  • Reflow soldering machine
  • Automated optical inspection (AOI) equipment
  • Nozzle with a 6 to 8 mm diameter
Baking devices
  • Cabinet oven
  • Anti-static heat-resistant trays
  • Anti-static heat-resistant gloves

Storage conditions

Storage conditions for a delivered module are as follows:

Baking requirements

Bake a module based on HIC status as follows when you unpack the module package:

Value read from the HIC Color circle color Operation
30%, 40%, and 50% All circles are blue Bake the module for 2 consecutive hours
30% Pink Bake the module for 4 consecutive hours
30% and 40% All circles are pink Bake the module for 6 consecutive hours
30%, 40%, and 50% All circles are pink Bake the module for 12 consecutive hours

Baking settings

Parameter Description
Baking temperature 125±5°C
Alarm temperature 130°C
SMT ready temperature Naturally cooling temperature: < 36°C
The number of drying times 1

Note: If the module is not soldered within 12 hours after being baked, you need to bake it again.

Recommended oven temperature curve

Perform SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow oven temperature curve is as below:

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Storage conditions

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MOQ and packaging information

Product Number MOQ (pcs) Shipping packaging method The number of modules per reel The number of reels per carton
WBRG1 3600 Tape reel 900 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-WBRG1. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WBRG1”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

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Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

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This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.